This is a high-performance automatic dispensing UV curing all-in-one device with built-in UVLED curing light source, which does not contain mercury and does not generate ozone. It has the characteristics of safety and environmental protection, low heat generation, super power saving, and long life. Light source size and fixture can be customized according to customer product requirements!
The specialized control system for dispensing uvled curing integrated machine
can be applied to any non-planar 3D dispensing path.
This dispenser equipment can quickly and accurately finish leveling and tilting fixtures
Array dispensing, offset correction, correction path setting, arcs, dots, and other complex spatial dispensing paths.
After dispensing, curing can be run without external computer. The whole process is fast and efficient.
The operation setting is simple and highly recommended.
uvled automatic dispenser application range: automotive mechanical parts coating, mobile phone button dispensing,
mobile phone battery packaging,laptop battery packaging, coil dispensing, PCB board bonding sealant, IC sealing
compound, speaker outer ring dispensing, PDA sealing compound,LCD sealant, IC package, IC bonding, case bonding,
optical device processing, mechanical sealing, etc.
The parameters of UV dispensing and curing machine are as follows:
Dispensing system details
UV LED curing system details
Working range (mm) X axis,Y axis,Z axis:300x300x100mm
Curing area:200x20mm
Maximum load Y/Z axis:6kg/4kg
Wavelength:365nm(can be customized)
Maximum velocity XY axis,Z axis:600mm/s、400mm/s
Light power density:2000mW/cm2
Driving mode:5-phase pulse motor drive
The number of LED:88
Transmission way:Synchronous belt
Electricity power:264W
Program storage quantity:Group 1000
Recommended curing distance:10-20mm
Single program maximum recording point:4000
Cooling mode:air cooling
Decomposition capability/repetition accuracy:0.0035mm/0.01mm
Power 0-100% adjustable
Input power supply:AC220V 50/60HZ
Control mode:host driver,single channel control
Single program maximum recording point
4000
Decomposition capability/repetition accuracy
0.0035mm/0.01mm
Working environment temperature/relative humidity:0-50℃/20-90%